Pressing of wire bond wire tips to provide bent-over tips

ABSTRACT

In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

FIELD

The following description relates to microelectronic devices. Moreparticularly, the following description relates to pressing of wire bondwire tips to provide bent over tips for a microelectronic device.

BACKGROUND

Microelectronic assemblies generally include one or more integratedcircuit dies (“ICs”), such as for example one or more packaged ICs(“chips”). One or more of such chips may be mounted on a circuitplatform, such as on a wafer for wafer-level-packaging (“WLP”), apackage substrate, an interposer, or a carrier. Additionally, one chipmay be mounted on another chip for a package-on-package (“PoP”) part.

A chip may include conductive elements, such as pathways, traces,tracks, vias, contacts, pads such as contact pads and bond pads, plugs,nodes, or terminals for example, that may be used for making electricalinterconnections with another circuit platform. These arrangements mayfacilitate electrical connections used to provide functionality of ICs.A chip may be coupled to a circuit platform by bonding, such as bondingtraces or terminals, for example, of such circuit platform to bond padsor exposed ends of pins or posts or the like of a chip. Interconnectingof one chip to another chip or to a circuit platform is relevant toreliability.

Accordingly, it would be desirable and useful to provide interconnectsthat enhance reliability.

BRIEF SUMMARY

A method relates generally to forming a microelectronic device. In sucha method, a substrate for the microelectronic device is loaded into amold press. The substrate has a first surface and a second surface. Thesecond surface is placed on an interior lower surface of the mold press.The substrate has a plurality of wire bond wires extending from thefirst surface toward an interior upper surface of the mold press. Anupper surface of a mold film is indexed to the interior upper surface ofthe mold press. A lower surface of the mold film is punctured with tipsof the plurality of wire bond wires for having the tips of the pluralityof wire bond wires extending above the lower surface of the mold filminto the mold film. The tips of the plurality of wire bond wires arepressed down toward the lower surface of the mold film to bend the tipsover.

Another method relates generally to forming a microelectronic device. Insuch other method, a substrate for the microelectronic device is loadedinto a mold press. The substrate has a first surface and a secondsurface. The second surface is placed on an interior lower surface ofthe mold press. The substrate has a plurality of wire bond wiresextending from the first surface toward an interior upper surface of themold press. An upper surface of a mold film is indexed to the interiorupper surface of the mold press. A lower surface of the mold film ispunctured with tips of the plurality of wire bond wires for having thetips of the plurality of wire bond wires located in the mold filmbetween the upper surface and the lower surface. A molding material isinjected between the first surface of the substrate and the lowersurface of the mold film. The molding material is cured to provide amolding layer. The mold film is removed from the substrate. The tips ofthe plurality of wire bond wires are pressed down toward an uppersurface of the molding layer to bend the tips over.

An apparatus relates generally to a microelectronic device. In such anapparatus, a substrate has a first surface and a second surface oppositethe first surface. The substrate has a plurality of wire bond wiresextending from the first surface. The substrate has a mold materiallayer on the first surface. Tips of the plurality of wire bond wiresextend beyond an upper surface of the mold material layer, and the tipsare bent over.

Other features will be recognized from consideration of the DetailedDescription and Claims, which follow.

BRIEF DESCRIPTION OF THE DRAWING(S)

Accompanying drawing(s) show exemplary embodiment(s) in accordance withone or more aspects of exemplary apparatus(es) or method(s). However,the accompanying drawings should not be taken to limit the scope of theclaims, but are for explanation and understanding only.

FIG. 1 is a respective block diagram of a cross-sectional side viewdepicting an implementation of a microelectronic device.

FIG. 2 is a respective block diagram of a cross-sectional side viewdepicting an implementation of a microelectronic device.

FIG. 3 is a respective block diagram of a cross-sectional side viewdepicting an implementation of a microelectronic device.

FIG. 4 is a block diagram of a top-down view of an exemplarymicroelectronic device.

FIG. 5 is a block diagram of a top-down view of an exemplarymicroelectronic device after tips have been bent over.

FIG. 6 is an enlarged side view depicting a pair of wire bond wiresattached to an upper surface of carrier prior to formation of a moldinglayer.

FIGS. 7-1 through 7-6 are a progression of block diagrams of a sidecutaway view depicting an exemplary manufacturing process havingoperations for forming a microelectronic device.

FIGS. 8-1 through 8-4 are a progression of block diagrams of a sidecutaway view depicting another exemplary manufacturing process havingoperations for forming a microelectronic device.

FIG. 9 is a block diagram of a side cutaway view depicting anotherexemplary substrate after a manufacturing process having operations forforming a microelectronic device but with an uppermost portion of an armof wire bond wires embedded in a mold film.

FIGS. 10-1 and 10-2 are block diagrams of a side cutaway view depictingyet another exemplary substrate after another manufacturing processhaving operations for forming a microelectronic device but with an upperportion of an arm of wire bond wires, longer than an uppermost portionthereof, embedded in mold film.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth toprovide a more thorough description of the specific examples describedherein. It should be apparent, however, to one skilled in the art, thatone or more other examples or variations of these examples may bepracticed without all the specific details given below. In otherinstances, well known features have not been described in detail so asnot to obscure the description of the examples herein. For ease ofillustration, the same number labels are used in different diagrams torefer to the same items; however, in alternative examples the items maybe different.

As previously described, chip to chip or wiring platform interconnectsare relevant to reliability. As described below, wire bond wire tips maybe pressed to provide bent over shaped tips for interconnects for amicroelectronic device. These bent over shaped tips may provide anchorsfor interconnecting a microelectronic device to an IC, a chip, and/or awiring platform. These anchors may be used to enhance reliability ofsuch interconnects.

FIGS. 1 through 3 are respective block diagrams of cross-sectional sideviews depicting several implementations of a microelectronic device 100.In each implementation, a substrate 150 for a microelectronic device 100may include an interposer or carrier 102 and a plurality of wire bondwires 110 generally extending from an upper surface 112 of such carrier102. Wire bond wires 110 may be BVA™ wires. Such a substrate 150 for amicroelectronic device 100 may further include one or more integratedcircuit dies 101.

After processing, such substrate 150 may yet further include a moldingmaterial layer (“molding layer”) 103. After molding, a substrate 150 mayhave a lower surface 111 and a generally opposite or opposing uppersurface 132 of a molding layer 103, and uppermost portions of wire bondwires 110 of such substrate 150 may extend above upper surface 132.

Wire bond wires 110 may be attached to upper conductive pads 105. Upperconductive pads 105 may be in contact with upper surface 112 of carrier102, in recesses of carrier 102 associated with upper surface 112,and/or in such recesses and extending above upper surface 112.Conductive interconnects 104, such as solder balls for example, may beattached to lower conductive pads 107. Lower conductive pads 107 may bein contact with lower surface 111 of carrier 102, in recesses of carrier102 associated with lower surface 111, and/or in such recesses andextending below lower surface 111. Upper and lower conductive pads 105and 107 may be coupled to one another through conductive vias 106.

Wire bond wires 110 may have a lower portion (“base”) 125, a middleportion (“arm”) 127, and an upper portion (“tip”) 126. Bases 125 may beattached to conductive pads 105, including without limitation traces orother conductive structures associated with carrier 102. Arms 127 mayextend from bases 125 to beyond an upper surface 122 of integratedcircuit die 101 in molding layer 103. Tips 126 may extend from arms 127to locations above upper surface 132 of molding layer 103. Molding layer103 may be injected or otherwise deposited on upper surface 112 ofcarrier 102. Molding layer 103 may further be injected or otherwisedeposited on upper surface 122 of integrated circuit die 101 forencapsulation of integrated circuit die 101.

Bond pads 108 of carrier 102 may be used for wire bonds 109 of lowerends of arched lead-over chip wires 117 to wire bonds 119 of upper endsof wires 117 to bond pads 118 of integrated circuit die 101. In thisconfiguration, a lower surface 121 of integrated circuit die 101 mayrest on an upper surface 112 of carrier 102, and bond pads 108 and 118may respectively be located on upper surfaces 112 and 122.

In the implementation of FIG. 1, arms 127 are generally at a 90 degreeangle 123 with respect to upper surface 112. However, in otherimplementations, such as generally indicated in FIG. 2, angle 123 may beless than or greater than 90 degrees. Furthermore, in FIG. 2, integratedcircuit die 101 is illustratively depicted as being coupled to carrier102 with microbumps 133 and associated pads 134. Optionally, moldinglayer 103 may not completely encapsulate integrated circuit die 101, asan upper surface 122 may be exposed. Optionally, as illustrativelydepicted in FIG. 3, attachment of wire bond wires 110 to carrier 102 maybe reinforced with intermetallic compound (“IMC”) structures, such assoldered bases 135.

For purposes of clarity and not limitation, many known details, as wellas alternative and/or optional configurations, for microelectronicdevices 100 have been omitted. Along those lines, variousconfigurations, other than those specifically described, may be used inaccordance with the following description.

With reference to FIG. 4, a block diagram of a top-down view of anexemplary microelectronic device 100 is illustratively depicted. In theexample, there are two concentric rectangular rings of wire bond wires110 forming an array 400. However, in other implementations, othernumbers of wire bond wires 110, array shapes, array dimensions, and/orother patterns of wire bond wires 110 may be used to provide an array400.

Tips 126 extend above upper surface 132 of molding layer 103. At aninterface between tips 126 and arms 127, there may be ledge 401. Ledges401 may, though need not be, horizontal surfaces projecting from a wallof tips 126. In FIG. 4, tips 126 have any of four orientations. However,these or other orientations of tips 126 may be used.

With reference to FIG. 5, a block diagram of a top-down view of anexemplary microelectronic device 100 is illustratively depicted, aftertips 126 have been bent over. Tips 126 may be bent over to have wallsurfaces respectively thereof in contact with or at least proximal tocorresponding ledges 401. This bending of tips 126 may be by placingsubstrate 150 into a molding press, as described below in additionaldetail. Accordingly, during pressing, tips 126 may be bent over in anyof a variety of orientations to provide bent over shapes for wire bondwires 110. Even though four orientations 501 through 504 areillustratively depicted by corresponding arrows for directions tips 126point after bending, these and/or other orientations may be used.Furthermore, even though orientations 501 through 504 point inwardlywith respect to array 400, namely an open space in the center of array400, in another implementation outwardly pointing tips 126, or acombination of inwardly and outwardly pointing tips 126, may be used.

FIG. 6 is an enlarged side view depicting a pair of wire bond wires110-1 and 110-2 attached to an upper surface 112 of carrier 102 prior toformation of molding layer 103. Prior to formation of molding layer 103,wire bond wires 110-1 and 110-2 may be attached to pads (not shown inthis FIG.) along upper surface 112 via corresponding solder bases 135.

Bases 125 of wire bond wires 110 may have j-like shapes, with bottomsthereof attached to upper surface 112 for forming wire bond wires 110.However, addition of solder bases 135 may provide additional support forenhanced reliability. Wire bond wire 110-2 may have approximately a 90rotation with respect to orientation of wire bond wire 110-1.

Tips 126 may have a generally horizontal surface, namely ledge 401,extending away from a facing wall surface 602 extending above acorresponding ledge 401. Again, ledges 401 may, though need not be,parallel with upper surface 112. Moreover, wall surfaces 602 may, thoughneed not be, orthogonal to corresponding ledges 401. Furthermore, a wallsurface 602 may, though need not be, orthogonal to a plane of uppersurface 112. In this example, front facing wall surface 602, as well asback facing wall surface 605, of a tip 126 is slightly tapered to narrowtip 126 toward a top surface 601 thereof. Right and left side surfaces604 of a tip 126 may both be tapered to widen tip 126 toward a topsurface 601 thereof. Along those lines, tip 126 may have a“shovelhead-like” or “fishtail-like” shape with a trapezoidal frontfacing outline being wider at a distal end than a proximal end toprovide such a widened tip 126. This “fishtail-like” shape may be formedwhen pinching and pulling off a feed wire used to for forming wire bondwires 110. Wire bond wires 110 may be shaped in the formation thereof toprovide such a “shovelhead-like” shape with a trapezoidal front facingoutline. While a shovelhead-like shape may be used to provide a greatersurface area for attachment to an IMC structure, other shapes maylikewise be used.

A bending locus may generally be at or slightly above the intersectionof ledge 401 and wall surface 602 for a tip 126, namely where a bendingradius or bending moment may likely occur when tips 126 are pressed, asdescribed below in additional detail. After pressing or bending of tips126, such tips may have a bent over shape. Such bent over shapesprovided by bent tips 126 may be used as anchors for solder or other IMCstructures.

FIGS. 7-1 through 7-6 are a progression of block diagrams of a sidecutaway view depicting an exemplary manufacturing process havingoperations 801 through 806 for forming a microelectronic device 100.FIGS. 7-1 through 7-6 are further described with simultaneous referenceto FIGS. 1 through 6, where the example of FIG. 6 is used in FIGS. 7-1through 7-6 for purposes of clarity by way of example and notlimitation.

At operation 801, a substrate 150 for microelectronic device 100 may beloaded or placed into a mold press 700. In this example, mold press 700has a bottom platen 701 and top platen 702. In this example, bottomplaten 701 is movable and top platen 702 is stationary. Optionally, topplaten 702 may optionally include a fixed plate 703 slightly raised oroffset from lower surface 706 to define an upper interior region 705within a cavity 710 between platens 701 and 702. Substrate 150 may beloaded into such cavity 710. However, in other implementations, no upperinterior region 705 may be present, as bent over tips may be pressedinto an upper surface of a deformable mold assist film, as describedbelow in additional detail. For purposes of clarity, known details of amold press 700 are not described herein.

After loading at 801, wire bond wires 110 of substrate 150 may extendfrom upper surface 112 toward an interior upper surface of mold press700, namely a lower surface 704 of plate 703. A lower surface 111 ofsubstrate 150 may be placed on an interior lower surface defining cavity710, namely an interior upper surface 709 of lower platen 701 of moldpress 700.

At operation 802, a mold assist film (“mold film”) 711 may be indexed toa lower surface 706 of top platen 702. Along those lines, an uppersurface 712 of a mold film 711 may be brought into contact or conformedto a portion of an interior upper surface, such as lower surface 706 forexample, of mold press 700 without leaving a gap between another portionof such interior upper surface, such as interior upper surface 706 forexample, of mold press 700 and upper surface 712 of mold film 711.Again, there is no optional gap for upper interior region 705.

At operation 803, mold film 711 may be punctured with tips 126 by movingbottom platen 701 in an upward direction 719. Along those lines, a lowersurface 721 and an upper surface 712 of mold film 711 may be puncturedwith tips 126 of wire bond wires 110 for having tips 126 to have tips126 bent over into upper surface 712 of mold film 711 deforming suchupper surface 712 of mold film 711 into an upper interior regionthereof, as generally indicated by arrow 723. In this position,substrate 150 is moved by moving lower platen 701 in an upward directionto cause tips 126 to bend toward and onto upper surface 712, asgenerally indicated by arrow 723. Optionally, upper platen 702 may bemoved in a downward direction as generally indicated by arrow 725.Moreover, optionally both upper platen 702 and lower platen 701 may bemoved in directions 719 and 725, respectively. Furthermore, optionally alateral movement 729 of upper platen 702 may be used to assist bendingof tips 126 to reduce likelihood of cracking of wire bond wires 110 dueto application of a compressive force. For uses of a lateral movement729, tips 126 may all have a same orientation.

At operation 804, tips 126 may continue to be pressed in a generallydownward direction to provide shaped bent over tips 126 for wire bondwires 110. In this example, bent over tips 126 may be flattened betweenlower surface 706 of platen 702 and into a deformable upper surface 712of mold film 711. This pressing of tips 126 may optionally includeflattening or coining of tips 126.

Furthermore, in this example, upper surface 712 of mold film 711 may becoplanar with ledges 401. However, in other examples, ledges 401 mayextend to or just above upper surface 712, and thus tips 126 may be bentdown for stopping on ledges 401 instead of being bent into upper surface712.

At operation 805, a molding material may be injected between uppersurface 112 of substrate 150 and lower surface 721 of mold film 711 formolding layer 103. At operation 806, such molding material may be curedto form molding layer 103, and mold film 711 may be used to assistrelease of substrate 150 with such molding layer 103 from mold press700.

After formation and release of substrate 150 from mold press 700,including removal of mold film 711 from substrate 150, there may be agap 730 between upper surface 132 of molding layer 103 and ledges 401,and this gap 730 may be associated with a partial thickness of mold film711, namely a lower portion of a distance between surfaces 712 and 721of mold film 711. Moreover, bent over tips 126 and uppermost portions ofarms 127 corresponding to gap 730 may extend above upper surface 132.Thus, lower surfaces of shaped bent over tips 126 may be spaced-awayfrom upper surface 132 of molding layer 103.

In the above example, tips 126 were bent prior to forming a moldinglayer 103. However, in another implementation, tips 126 may be bentafter forming a molding layer 103.

In either order, tips 126 may be pressed down against an upper surface712 of mold film 711, and such tips 126 may thus be bent over leaving aspace between bottom surfaces of such tips 126 and upper surface 132 ofmolding layer 103 after removal of mold film 711. Again, tips 126 may beshaped prior to loading into mold press 700, and such shaped tips 126may be to provide bending locations for bending. The above process maygenerally be thought of as a pressing of tips prior to molding, namely apressing-before-molding process. The following description may generallybe thought of as a pressing-after-molding process.

FIGS. 8-1 through 8-4 are a progression of block diagrams of a sidecutaway view depicting an exemplary manufacturing process havingoperations 903 through 906 for forming a microelectronic device 100.FIGS. 8-1 through 8-4 are further described with simultaneous referenceto FIGS. 1 through 7-6, where the example of FIG. 6 is used in FIGS. 8-1through 8-4 for purposes of clarity by way of example and notlimitation.

Prior to operation 903, operations 801 and 802 may be performed aspreviously described. However, in operation 802 a thicker mold film 711is indexed to a lower surface of upper platen 702. In the above exampleof a thinner mold film 711, such mold film thickness may be in a rangeof approximately 10 to 50 microns, and in the example of a thicker moldfilm 711, such mold film thickness may be in a range of approximately 50to 150 microns. In other implementations, these or other ranges may beused. For example, for anchors using bent over tips 126, longer tips maybe used and correspondingly thicker molding film to provide more surfacearea for anchoring at the expense of a larger pitch. Bent over tips 126may be used as anchors for soldering for example.

At operation 903, this thicker mold film 711 may be punctured with tips126 by moving either or both lower platen 701 and upper platen 702, aspreviously described. In this example, lower platen 701 is moved in anupward direction 719. Along those lines, a lower surface 721 and anupper surface 712 of mold film 711 may be punctured with tips 126 ofwire bond wires 110 for having at least a substantial portion, if notall, of tips 126 extend above lower surface 721 of mold film 711 into aninterior region of mold film 711, namely having such substantial portionof such tips 126 located in mold film 711 between upper surface 712 andlower surface 721 of such mold film 711 prior to molding. Optionally,uppermost portions of arms 127 may likewise extend into mold film 711prior to molding. In this example, lower surface 721 is generallyco-planar with ledges 401; however, ledges 401 may be above, equal with,and/or below lower surface 721 in this or other implementations.

At operation 904, a molding material may be injected between uppersurface 112 of substrate 150 and lower surface 721 of mold film 711 formolding layer 103. At operation 905, such molding material may be curedto form molding layer 103, and mold film 711 may be used to assistrelease of substrate 150 from such molding layer 103 and then such moldfilm 711 may be removed from mold press 700.

After formation of molding layer 103 and removal of mold film 711 fromsubstrate 150 at operation 905, upper surface 132 of molding layer 103and ledges 401 may optionally be co-planar, as in this example. However,as previously indicated, such ledges 401 may be above or below uppersurface 132. At 906, substrate 150 may be moved by having lower platen701 moved in an upward direction 719 to cause tips 126 to be pressedinto lower surface 706 of upper platen 702 to bend such tips 126 towardupper surface 132, as generally indicated by arrow 723 in FIG. 8-3.

At operation 906, tips 126 may be pressed down against an upper surface132 of molding layer 103, and such tips 126 may thus be bent over. Afterbending, tips 126 may optionally be against upper surface 132 of moldinglayer 103, which optionally may leave no readily perceivable gap betweenbottom surfaces of such tips 126 and upper surface 132 of molding layer103. Again, tips 126 may be shaped prior to loading into mold press 700,and such shaped tips 126 may be to provide bending locations.

Pressing of such tips 126 may optionally flatten such tips between uppersurface 132 of molding layer 103 and lower surface 706 of upper platen702. Again, though lower platen 701 may be raised for this pressing,either or both platens may be moved for pressing, as described elsewhereherein, to provide bent over tips 126. Such pressing may further flattentips, which may spread out such tips 126. After such pressing operationat 906, substrate 150 may be removed from mold press 700. By pressingafter molding, arms 127 may have some protection from compressivestresses by molding layer 103.

As previously described an uppermost portion of an arm 127 may beembedded in mold film 711. Along those lines, FIG. 9 is a block diagramof a side cutaway view depicting another exemplary substrate 150 after amanufacturing process having operations for forming a microelectronicdevice as described above but with an uppermost portion 911 of an arm127 of wire bond wires 110 embedded in mold film 711. Such uppermostportions 911 of arms 127 of wire bond wires 110 may be adjacent andintegral with lowermost portions of such tips 126. Along those lines, apressing after molding may be used to bend tips 126 over to have anuppermost portion of such tips bent down to be at least proximate to ortouching upper surface 132. Such bent over tips 126 may define anunderside through region or air gap 913, such as for a hook-likestructure or shape for example. Optionally, a solder ball 914 may beplaced over tips 126, and such bent over tips 126 may be used to anchorsuch solder balls 914, namely solder anchors which may includecompletely or partially filing such air gaps 913 with solder to assistin anchoring.

As previously described an uppermost portion of an arm 127 may beembedded in mold film 711. Along those lines, FIGS. 10-1 and 10-2 areblock diagrams of a side cutaway view depicting yet another exemplarysubstrate 150 after another manufacturing process having operations forforming a microelectronic device as described above but with an upperportion 912, longer than an uppermost portion 911, of an arm 127 of wirebond wires 110 embedded in mold film 711. Such upper portions 912 ofarms 127 of wire bond wires 110 may include such uppermost portions 911and thus may be adjacent and integral with lowermost portions of suchtips 126. Along those lines, a pressing after molding may be used tobend tips 126 over to have an uppermost portion of such tips bent downto be at least proximate to or touching upper surface 132. Such bentover tips 126 may define an underside through region 913, such as for ahook-like structure or shape for example. Optionally, a solder ball 914may be placed over tips 126, and such bent over tips 126 may be used toanchor such solder balls 914, including completely or partially filingsuch air gaps 913 to assist in anchoring.

While the foregoing describes exemplary embodiment(s) in accordance withone or more aspects of the invention, other and further embodiment(s) inaccordance with the one or more aspects of the invention may be devisedwithout departing from the scope thereof, which is determined by theclaim(s) that follow and equivalents thereof. Claim(s) listing steps donot imply any order of the steps. Trademarks are the property of theirrespective owners.

What is claimed is:
 1. A method for forming a microelectronic device,comprising: loading a substrate for the microelectronic device into amold press; the substrate having a first surface and a second surface;the second surface being placed on an interior lower surface of the moldpress; the substrate having a plurality of wire bond wires extendingfrom the first surface toward an interior upper surface of the moldpress; indexing an upper surface of a mold film to the interior uppersurface of the mold press; puncturing a lower surface of the mold filmwith tips of the plurality of wire bond wires for having the tips of theplurality of wire bond wires extending above the lower surface of themold film into the mold film; puncturing an upper surface of the moldfilm with one or more of the tips of the plurality of wire bond wires;pressing the tips of the plurality of wire bond wires down toward thelower surface of the mold film to bend the tips over; and bending thetips over responsive to the pressing for having bent over shapes for thetips.
 2. The method according to claim 1, wherein the pressing furthercomprises pressing the tips into the upper surface of the mold film fordeforming the upper surface of the mold film.
 3. The method according toclaim 2, further comprising: injecting a molding material between thefirst surface of the substrate and the lower surface of the mold film;and curing the molding material.
 4. The method according to claim 3,further comprising: releasing the substrate from the mold pressincluding removal of the mold film from the substrate; wherein the tipsare bent over responsive to the bending leaving a space between bottomsurfaces of the tips and a top surface of the molding material.
 5. Themethod according to claim 4, wherein the tips are flattened between theupper surface of the mold film and the upper interior surface of themold press.
 6. The method according to claim 4, wherein the tips havetrapezoidal front facing outlines prior to the pressing.
 7. The methodaccording to claim 4, wherein the tips have shapes to provide locationsfor the bending.
 8. The method according to claim 4, wherein the tipsare bent over to provide solder anchors after the pressing.
 9. Themethod according to claim 1, wherein the pressing comprises lowering theupper interior surface of the mold press for the pressing of the tipsdown against the upper surface of the mold film.